SK Hynix Introduces Advanced Packaging Technology to Advance Next-Generation HBM Solutions
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SK Hynix is introducing advanced packaging technologies, including Intel's EMIB, for its next-generation HBM solutions, aiming to enter the 3D packaging era. At the 2026 Hot Chips conference, SK Hynix's Vice President of Packaging Engineering, Jaesik Lee, presented a report titled "Advanced Packaging for High Bandwidth Memory," explaining how the company plans to leverage advanced packaging technologies to accelerate its HBM product roadmap. SK Hynix is currently exploring methods such as hybrid bonding to overcome the limitations of 16-layer stacking, with future plans to address power consumption challenges by increasing the number of TSVs, enhancing the IO speed of logic process integration, and optimizing the power distribution network. As of the time of publication, SK Hynix's stock rose by 1.71%.
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